计算机科学 ›› 2015, Vol. 42 ›› Issue (Z6): 115-117.
蒋玉芳,邓左祥
JIANG Yu-fang and DENG Zuo-xiang
摘要: 现代工艺的发展使得集成电路在获得高性能的同时,也更容易受到软差错的影响。针对软差错影响下电路的可靠性问题,选取了二种典型的基于条件概率理论的门级评估方法:BN方法和PTM方法,分别介绍了其原理,并结合实验分析了它们各自的功能、适用范围以及复杂度,且指出了下一步的研究思路。
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