计算机科学 ›› 2016, Vol. 43 ›› Issue (5): 9-12, 21.doi: 10.11896/j.issn.1002-137X.2016.05.002

• 目次 • 上一篇    下一篇

软差错影响下的电路可靠性分析

王真,江建慧   

  1. 上海电力学院计算机科学与技术学院 上海200090,同济大学软件学院 上海201804
  • 出版日期:2018-12-01 发布日期:2018-12-01
  • 基金资助:
    本文受国家自然科学基金重点项目(61432017),上海电力学院人才启动基金项目(K-2013-017),上海高校青年教师资助

Reliability Analysis of Circuit under Soft Error

WANG Zhen and JIANG Jian-hui   

  • Online:2018-12-01 Published:2018-12-01

摘要: 随着大数据时代的到来,人们对微处理器可靠性的要求也越来越高,同时处理器芯片内电路密度的增大使其更易受到软差错的侵害,因此软差错影响下的电路可靠性问题显得尤为重要。针对这一问题,从系统结构级、RTL、门级及电路级4个抽象层次进行了全面的分析,并在每个抽象层次上依据方法属性做了分类介绍和比较。

关键词: 可靠性分析,电路级,门级,RTL,系统结构级

Abstract: With the coming of the big data era,people demand more reliable microprocessor.While the intensive techno-logy scaling make the circuit encounter greater sensitivity to soft errors.It’s very important to analyze the reliability of the circuit under soft errors.This paper gave a survey on the reliability analysis methods,which are categorized into circuit-level,gate-level,register-transfer-level(RTL) and architecture-level,and introduced and compared these methods according to method property in each level.

Key words: Reliability analysis,Circuit level,Gate level,RTL,Architecture level

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