Computer Science ›› 2009, Vol. 36 ›› Issue (7): 288-291.doi: 10.11896/j.issn.1002-137X.2009.07.071

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SMT Solder Joint 3D Reconstruction Technology Based on Shape from Shading

ZHAO Hui-huang,ZHOU De-jian,HUANG Chun-yue,ZHANG Shao-hua   

  • Online:2018-11-16 Published:2018-11-16

Abstract: The principles of the surface mount solder 3D reconstruction technology based on Shape from Shading could be described as following; the practical solder joint image was obtained by image acquisition, and deal with the solder joint image by using some image processing arithmetic. According to a definitive reflection model, the constraint relation between the surface shape and image lighteness was built. Another constraint relation for the parameters of the objects surface shape is based on the prior knowledge of the object surface shape. Then finding solutions by those constraint relations can obtain the 3D shape of the objects surface. Furthermore,aiming at the defects of unfavorable result for the unaccepted solder joint 3D reconstruction,we improved 3D reconstruction algorithm. Based on expatiation of the principles of the surface mount solder 3D reconstruction technology, its implementation method and steps were introduced with practical examples. Some key technologies, including image acquisition and processing, solder joints three-dimensional and algorithms were also discussed. Some results were given as examples to verify feasibility of this technology.

Key words: Surface mount technology solder joint,Three-dimensional reconstruction,Image processing,SFS

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